High-Performance Three-Zone PECVD System for Precision Thin Film Deposition
Product Overview
The ZYLAB 1200°C Dual-Zone PECVD System is designed for advanced thin-film deposition processes requiring precise precursor evaporation, stable plasma conditions, and reliable exhaust management. Equipped with a solid–liquid evaporation module, 4-channel mass-flow-controlled gas delivery, and an anti-condensation exhaust treatment design, this system offers a highly efficient, safe, and environmentally friendly PECVD solution.
In this configuration, a liquid vapor generator is installed at the front end to ensure accurate delivery of liquid precursors, while a vacuum pump exhaust treatment tank is integrated at the backend to minimize harmful emissions. Together, they create a stable and clean deposition environment, preventing condensate buildup and ensuring long-term operational reliability.
This PECVD system is ideal for research institutes, laboratories, semiconductor processing, epitaxy, dielectric coatings, surface modification, and high-precision material deposition applications.
Key Features of 1200°C Dual-Zone PECVD System
1. Precision Temperature Control System
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Advanced PID regulation: Ensures highly accurate control of evaporation and deposition temperatures for optimal precursor vaporization.
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Fast response: Supports rapid heating and cooling to accommodate diverse process requirements.
2. High-Efficiency Evaporation
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Optimized evaporator design: Maximizes evaporation efficiency while minimizing residue buildup, ensuring stable and consistent vapor delivery.
3. Reliable Anti-Condensation Measures
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The vacuum pump exhaust treatment tank effectively removes or reduces harmful gases such as VOCs, acidic compounds, and particulates.
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Prevents condensation inside pipelines and equipment, ensuring safe operation and compliance with environmental standards.
4. Intelligent Control & Monitoring
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Touch-screen interface: Intuitive operation for parameter setting, process control, and system monitoring.
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Data logging & analysis: Automatically records key operational data and generates exportable reports for process optimization.
5. 4-Channel Gas Delivery System
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Equipped with high-precision mass flow controllers (MFCs), allowing accurate and independent gas input control for complex PECVD processes.
Technical Parameters
| Model | PECVD1200-80-2 | |
| Rated Power | 7.5 kW + 1.5 kW | |
| Power Supply | Three-phase 380 V, 50 Hz | |
| RF Frequency | 13.56 MHz | |
| RF Power Range | 0–500 W | |
| Deposition Heating Power | 2.5 kW | |
| Evaporator Rated Power | 1.3 kW | |
| Heating Tape Power | 75 W | |
| Maximum Temperature (Tmax) | 1200°C | |
| Deposition Temperature | 1150°C | |
| Evaporator Temperature | 400°C | |
| Heating Tape Temperature | 150°C | |
| Temperature Accuracy | ±1°C | |
| Sensor Type | K-type Thermocouple | |
| Heating Rate | 1°C/h – 20°C/min | |
| Chamber Size | (Zone 1)Φ150 × 200 mm | |
| (Zone 2)Φ150 × 200 mm | ||
| Quartz Tube Size | Φ80 × 1400 mm | |
| Heating Element | ![]() |
Mo-doped Fe-Cr-Al Alloy |
| Gas Delivery (4 Channels) | Mass Flow Controllers: S500 50 SCCM × 2 channels: Φ6.35 compression fittings, N₂-calibrated S500 30 SCCM × 1 channel: Φ6.35 compression fittings, N₂-calibrated S500 1000 SCCM × 1 channel: Φ6.35 compression fittings, N₂-calibrated |
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| Control System | ![]() |
Programmable sintering/processing curves with dynamic graphical display Scheduled processing for unattended operation Real-time power/voltage display, full data recording and export Remote monitoring and control capability Temperature calibration: Non-linear correction based on master and sample temperature deviations |
| Liquid Vapor Generator + Peristaltic Pump | ![]() |
Ensures precise delivery of liquid precursors Efficient conversion from liquid to vapor phase Guarantees uniform gas transport, enhancing film quality and process repeatability |
| Vacuum Pump Exhaust Treatment Tank | ![]() |
Removes VOCs, acidic gases, and particulates Prevents condensation and pipeline contamination Ensures emissions meet environmental safety standards Protects equipment and operator safety |
| Furnace size | 2230 × 800 × 1300 mm | |
| Net weight | 260 kg | |
| Service Support | 1-year limited warranty, with lifetime support (Warranty excludes consumable parts such as processing tubes and O-rings; please order replacement parts from the related products section below). | |
Optional Upgrades(Exhaust Gas Purifier)

ZYLAB Epitaxial Furnace Exhaust Gas Purifier
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Features two spray chambers + one packed column
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Manual negative pressure control
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Adjustable water replenishment
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Achieves up to 99.99% removal efficiency for water-soluble gases
Ideal for semiconductor epitaxy, PECVD, LPCVD, MOCVD, and other gas-heavy processes.
Typical Application
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Semiconductor Processing
Deposition of dielectric films, passivation layers, barrier coatings, and encapsulation layers for silicon wafers, compound semiconductors, and advanced microelectronics. -
Surface Engineering & Functional Coatings
Fabrication of protective, optical, insulating, and barrier films used in optics, energy devices, and electronic components. -
Epitaxy and Material Growth
Controlled deposition of high-purity thin layers for epitaxial structures and advanced material synthesis. -
Nanomaterials & Advanced Thin Films
Growth of nanostructured films, nanocomposites, and functional materials requiring precise plasma-enhanced reactions. -
MEMS & Sensor Fabrication
Deposition of structural, insulating, and functional layers for micro-electromechanical systems and high-sensitivity sensors. -
Photovoltaics & Energy Technologies
Thin-film deposition for solar cells, battery electrodes, protective layers, and energy storage materials. -
R&D Laboratories & Universities
Experimental development of new thin-film processes, precursor studies, material property research, and atmospheric/temperature-dependent deposition experiments.
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